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ISL29004
WINDOW LENS
t
Suggested PCB Footprint
Footprint pads should be a nominal 1-to-1 correspondence
with package pads. The large exposed central die-mounting
paddle in the center of the package has no electrical
?
D1
D TOTAL
connection. It is, however, recommended to have the
thermal pad soldered to GND for package reliability.
Layout Considerations
The ISL29004 is relatively insensitive to layout. Like other
ISL29003/4
D LENS
? = VIEWING ANGLE
I 2 C devices, it is intended to provide excellent performance
even in significantly noisy environments. There are only a
few considerations that will ensure best performance.
Route the supply and I 2 C traces as far as possible from all
sources of noise. Use two power-supply decoupling
FIGURE 4. FLAT WINDOW LENS
TABLE 16. RECOMMENDED DIMENSIONS FOR A FLAT
WINDOW DESIGN
capacitors, 4.7μF and 0.1μF, placed close to the device.
Typical Circuit
D TOTAL
1.5
2.0
2.5
3.0
3.5
D1
0.50
1.00
1.50
2.00
2.50
D LENS @ 35
VIEWING ANGLE
2.25
3.00
3.75
4.30
5.00
D LENS @ 45
VIEWING ANGLE
3.75
4.75
5.75
6.75
7.75
A typical application for the ISL29004 is shown in Figure 6.
Additional I 2 C address select pins A0 and A1 are available
for the ISL29004 so a maximum of four ISL29004 devices
can be tied on the same I 2 C bus line.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The ISL29004’s
plastic ODFN package does not require a custom reflow
t=1
D1
D LENS
D TOTAL
Thickness of lens
Distance between ISL29001 and inner edge of lens
Diameter of lens
Distance constraint between the ISL29001 and lens
outer edge
soldering profile, and is qualified up to +260°C. A standard
reflow soldering profile with a +260°C maximum is
recommended.
Special Handling
* All dimensions are in mm.
ODFN8 is rated as JEDEC moisture level 4. Standard
JEDEC Level 4 procedure should be followed: 72hr floor life
at less than +30°C 60% RH. When baking the device, the
temperature required is +110°C or less due to its special
molding compound.
Dimensions in mm
FIGURE 5. SUGGESTED PCB FOOTPRINT
13
FN6221.1
November 17, 2011
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